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 The slurry is prepared from the solution by a variety of chemical active agents and functional additives, it has a non-toxic, non-corrosive, non-perishable performance, an important position in the polishing process. Many different types of slurry should be based on the processing conditions to select a reasonable choice of the slurry, enables processing of the workpiece surface bright and beautiful, bright color, you can prevent corrosion of the workpiece, maintain and improve the luster of the surface, play a cleaning workpiece with The role of the abrasive. The slurry can also remove the oil, to soften the surface to accelerate the grinding, reducing impact of abrasive workpiece, improving working conditions. In finishing efficiency and the quality of the workpiece grinding, polishing, brightness, slurry shows its unique effect. 

 Nano-silica slurry introduction (CMP) of the nano-silica slurry is a slurry for chemical mechanical polishing performance, apply to the nanometer and sub-nanometer silicon compound crystals, precision optics, precious stones polishing process. The basic nature of the polishing liquid Appearance: White Liquid Density: 1.15g/ml of pH values: 9.8 ± 0.5 particle size: 70nm slurry composition content (w%) SiO2 20 ± 1 of Na2O ≤ 0.3 heavy metal impurities ≤ 5ppm of the Company in addition to current production The sodium-type polishing liquid, but also the production of sodium silica slurry, precision cast technology be applied to crystals of silicon and compounds. Polishing parameters (reference value) polishing pressure: 150 ~ 250g/cm ² polishing temperature: the dilution rate of 10 ~ 38 ° C <1:1 10 polishing time: 3 6min packing: 500ml / bottle Storage: The product is to be at 0 ° C more than storage, to prevent freezing, below zero and failure to produce can not be re-dispersed agglomeration. Security: This product is alkaline liquid, use, transportation and storage process, please pay attention to the health, safety and environmental information. :0.01-0 .1 um particle size single crystal of the diamond powder model :0.05-50um polycrystalline :0.05-6um nano-fine cerium oxide powder :0.1-3um 


 Abrasive material: Japan Fujimi, agent of the company: FO polishing powder (F01200); FM polishing powder WA alumina polishing powder (WA2000 `WA4000); the PWA alumina polishing powder; the WCA precision alumina polishing powder; the GC silicon carbide powder ( GC280 Professional `320) for the chip (sapphire) polished FUJIMI 
 Diamond polishing solution: We have from 0.1um `0.25 um` 0.5 um um um 9. Guarantee sustained and efficient grinding polycrystalline diamond imported from abroad strictly graded diamond particles are not guaranteed will not damage the workpiece surface, to avoid the debris and hurt the film phenomenon in a thinning process. Waterborne, oil, suspended in the industry have received great recognition. Sapphire, silicon carbide wafer, ceramic or other hard crystalline aspect, we have an absolute advantage. 
 The price of large favorably welcome new and old customers call just discuss!