Main features: 
 A. Excellent mechanical properties and electrical insulation properties; Very good heat-stabilized, good thermal conductivity; Of Na +, Cl-content is very low, the sealing performance; Mobility, fast curing, good mold release; Product consistency and good stability. Applications: 
 Mainly used for plastic, medium-scale integrated circuits, such as DIP28-DIP42; plastic high power devices. 
 Mainly used in plastic discrete devices: TO-92 TO-92SP TO-92MOD, the TO-126 TO-202 TO-220, silicon stack. 
 For plastic diode, 1A-8A. 
 Mainly used for plastic, small-scale integrated circuits, such as DIP8-DIP22. 
 Mainly used for plastic encapsulated TO-3P, full encapsulation of the TO-220, the combination of devices, the combination module. 
 Mainly used for plastic LSI, such as DIP, PLCC, SOP, the SOJ and QFP. 
 Mainly used in plastic TQFP, TSOP, TSSOP, and thin surface-mount circuit. 
 Mainly used for thin plastic TQFP, TSOP, TSSOP surface-mount circuit and a line width of 0.5 micron DRAM. 
 How to use: 
 Epoxy molding compound products, there are two kinds of powder and cake material. Powder in plastic barrels packaging, cake material cartons. Cake material specifications for the diameter of 11mm, 13mm, 18mm, 38.5mm, 40mm, 43mm, 48mm, 55mm, weight according to customer needs may be. This product is stored below 10 ℃, storage period of 12 months. Before use, remove from the cold enabled at room temperature for 24 hours. Preformed in a dry environment (relative humidity below 55%). Should be noted that the molding compound to prevent the pre-forming and storing moisture. 
 The price of large favorably welcome new and old customers call just discuss!