FO series is prepared Fu Jimi unique proportion of alumina, zirconia abrasive according scrub. Special crystal type of milling particles and mixed materials of appropriate hardness, so that the grinding amount unaffected machined surface can reach the finish of the design at the same time, relatively more soft. Therefore, a series of milling in addition to widely used in various types of semiconductor material wafer grinding, especially popular for use in various types of optical glass with optical crystal precision machining of lenses, prisms, mirrors, filters, and the surface of the piezoelectric material. 
 WA, A Series of high-purity white aluminum oxide abrasive, under the control of the stringent particle size distribution is divided into 21 of the label covers from 57 micron to 0.3 micron center particle size, have different requirements for surface finish various types of electronic, optical and metal materials. 
 GC, C, green silicon carbide abrasive powder particles were α-type hexagonal crystal is of high hardness only to diamond hardness abrasive, the highest label the center of the particle size of 0.3 micron, it uses a wide range of high grinding rate ideal powder, such as silicon, lithium niobate, lithium tantalate, precision ceramic, crystal and other materials, wire cutting, grinding and even polishing. 
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